Fabricant | No de pièce | Fiches technique | Description |
Assmann Electronics Inc...
|
AK672MB |
109Kb/1P |
USB Cable, Transparent Design, |
Seoul Semiconductor
|
STW8C2PA |
1Mb/31P |
Thermally Enhanced Package Design |
STW9C2SA |
1Mb/32P |
Thermally Enhanced Package Design |
KODENSHI_AUK CORP.
|
PIC-A1804 |
1Mb/3P |
Compact and lightweight design |
TDK Electronics
|
CEU3E2X7R1H103K080AE |
139Kb/1P |
Automotive Grade ( Serial Design ) |
CEU3E2X7R1H223M080AE |
138Kb/1P |
Automotive Grade ( Serial Design ) |
CEU3E2X7R1H682K080AE |
139Kb/1P |
Automotive Grade ( Serial Design ) |
CEU3E2X7R2A152M080AE |
138Kb/1P |
Automotive Grade ( Serial Design ) |
CEU3E2X7R2A332M080AE |
138Kb/1P |
Automotive Grade ( Serial Design ) |
CEU4J2X7R2A153M125AE |
138Kb/1P |
Automotive Grade ( Serial Design ) |
Texas Instruments
|
TLK1201ARCP |
1,010Kb/24P |
Single Monolithic PLL Design |
FSP TECHNOLOGY INC.
|
MPLUS120K |
326Kb/1P |
Modular design decreases MTTR |
TDK Electronics
|
CEU3E2X7R1H153M080AE |
138Kb/1P |
Automotive Grade ( Serial Design ) |
CEU3E2X7R1H333M080AE |
138Kb/1P |
Automotive Grade ( Serial Design ) |
CEU4J2X7R1H104K125AE |
138Kb/1P |
Automotive Grade ( Serial Design ) |
Axiomtek Co., Ltd.
|
RBOX111-4COM |
427Kb/2P |
Fanless and cableless design |
RBOX510-6COM |
459Kb/2P |
Fanless and cableless design |
Seoul Semiconductor
|
STW8C2SB-NZ |
1Mb/30P |
Thermally Enhanced Package Design |
STW7C12Y |
886Kb/25P |
Thermally Enhanced Package Design |
FSP TECHNOLOGY INC.
|
MPLUS150K |
327Kb/1P |
Modular design decreases MTTR |