Fabricant | No de pièce | Fiches technique | Description |
Mini-Circuits
|
BMP-5075R |
181Kb/1P |
Matching Pad REV. D |
CUI INC
|
SF100 |
241Kb/2P |
THERMAL PAD |
T-Global Technology
|
TG-AL375 |
422Kb/1P |
Thermal Pad 20230721 |
CUI Devices
|
SF400 |
236Kb/2P |
THERMAL PAD 08/05/2022 |
All Sensors Corporation
|
EGBD |
42Kb/1P |
For suggested pad layout, see drawing: PAD-01 |
P1NR |
228Kb/1P |
For suggested pad layout, see drawing: PAD-01 |
P2NQ |
207Kb/1P |
For suggested pad layout, see drawing: PAD-01 |
CFFS |
275Kb/1P |
For suggested pad layout, see drawing: PAD-01 |
CPFR |
290Kb/1P |
For suggested pad layout, see drawing: PAD-01 |
EGNL |
39Kb/1P |
For suggested pad layout, see drawing: PAD-01 |
PTNQ |
250Kb/1P |
For suggested pad layout, see drawing: PAD-01 |
PTNR |
238Kb/1P |
For suggested pad layout, see drawing: PAD-01 |
P2BS |
220Kb/1P |
For suggested pad layout, see drawing: PAD-01 |
P1NS |
224Kb/1P |
For suggested pad layout, see drawing: PAD-01 |
P2NR |
221Kb/1P |
For suggested pad layout, see drawing: PAD-01 |
P2NS |
218Kb/1P |
For suggested pad layout, see drawing: PAD-01 |
PTNS |
229Kb/1P |
For suggested pad layout, see drawing: PAD-01 |
EGNJ |
44Kb/1P |
For suggested pad layout, see drawing: PAD-01 |
P1BR |
226Kb/1P |
For suggested pad layout, see drawing: PAD-01 |
EGNS |
38Kb/1P |
For suggested pad layout, see drawing: PAD-01 |