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PACKAGE Fiches techniques, Datasheet

ALL A-BRIGHT Inc(45)Abracon Corporation(22)ACCUTEK MICROCIRCUIT CORPORATION(8)Actel Corporation(3)Acutechnology Semiconductor(10)Advanced Analog Technology, Inc.(2)Advanced Analogic Technologies(8)Advanced Crystal Technology(10)Advanced Micro Devices(14)Advanced Photonix, Inc.(19)Advanced Power Electronics Corp.(112)Advanced Power Technology(2)Advanced Semiconductor(4)Advanced Thermal Solutions, Inc.(14)Advanced XTAL Products(87)Advantech Co., Ltd.(2)Aeroflex Circuit Technology(3)AIMTEC(1)All Sensors Corporation(4)Allegro MicroSystems(13)Allen-Bradley(1)Alliance Semiconductor Corporation(17)Allied Components International(3)Alpha & Omega Semiconductors(70)ALPS ELECTRIC CO.,LTD.(2)Altera Corporation(5)American Accurate Components, Inc.(5)American Microsemiconductor(1)AMIC Technology(4)Amkor Technology(20)Amphenol Corporation(3)Analog Devices(81)Analog Intergrations Corporation(1)Analog Microelectronics(1)Anaren Microwave(5)Anpec Electronics Coropration(2)Anshan Suly Electronics(1)API Delevan(3)Aries Electronics, Inc.(4)Asahi Kasei Microsystems(35)Astec America, Inc(2)ATMEL Corporation(2)AVAGO TECHNOLOGIES LIMITED(127)AVG Semiconductors(HITEK)(1)Avic Technology(1)AVX Corporation(1)Bel Fuse Inc.(3)BetLux Electronics(15)Bi technologies(3)Bolymin, Inc(73)Bothhand USA, LP.(6)Bourns Electronic Solutions(9)BRIGHT LED ELECTRONICS CORP(41)Broadcom Corporation.(53)Bruckewell Technology LTD(2)Bud Industries, Inc.(1)C&D Technologies(1)C&K Components(1)California Eastern Labs(72)California Micro Devices Corp(9)CAMBION Electronic Components(4)Catalyst Semiconductor(3)Central Semiconductor Corp(39)Chicago Miniature Lamp,inc(9)CITIZEN ELECTRONICS CO., LTD.(98)Clairex Technologies, Inc(11)CML Microcircuits(3)Compensated Deuices Incorporated(4)Connor-Winfield Corporation(1)Continental Device India Limited(55)COSMO Electronics Corporation(23)Cree, Inc(1)Crydom Inc.,(5)Crystek Corporation(1)CTS Corporation(5)CUI INC(3)Cypress Semiconductor(3)Cystech Electonics Corp.(3)DAICO Industries, Inc.(1)Dallas Semiconductor(4)Datatronic Distribution, Inc.(3)DB Lectro Inc(14)Delta Electronics, Inc.(12)Dialight Corporation(13)Dialog Semiconductor(2)DinTek Semiconductor Co,.Ltd(1)Diodes Incorporated(33)DIYI Electronic Technology Co., Ltd.(2)E-SWITCH(44)E-Tech Electronics LTD(3)Ecliptek Corporation(1)ECS, Inc.(4)Elantec Semiconductor(1)ELM Electronics(2)ELM Technology Corporation(34)Emerson Network Power(4)Enpirion, Inc.(1)Eon Silicon Solution Inc.(3)EPCOS(2)Epson Company(2)ETA SOLUTIONS CO. LIMITED(1)EUROQUARTZ limited(9)Eutech Microelectronics Inc(6)Everlight Electronics Co., Ltd(389)Exar Corporation(2)Galaxy Semi-Conductor Holdings Limited(22)Jiangsu Yutai Electronics Co., Ltd(2)List of Unclassifed Manufacturers(48)List of Unclassifed Manufacturers(67)Nanjing International Group Co(3)SHANGHAI BELLING CO., LTD.(1)
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Description trouvée : 'Package' - Totale: 12321 (1/617) Page
FabricantNo de pièceVoirDescription

Zetex Semiconductors
SC70-5 Surface mounted, 5 pin package Package outline

Advanced Power Electron...
AP2622GY-HF Low Gate Charge, Small Package Outline, Surface Mount Package

Fairchild Semiconductor
MSA20 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20

National Semiconductor ...
D40C 40 Lead Ceramic Sidebrazed Dual-in-Line Package NS Package Number D40C

Vectron International, ...
C4530 OCXO Surface Mount Package Reflow Process Compatible AT-Cut and SC-Cut Crystal Options Low Profile Compact Package

Shindengen Electric Mfg...
S15WB60_17 Square In-line Package (Input/Output In-line Package)

National Semiconductor ...
J24A 24 Lead Ceramic Dual-in-Line Package NS Package Number J24A
D16D 16 Lead Hybrid Metal Can Dual-in-Line Package NS Package Number D16D

Amkor Technology
PSVFBGA Package on Package (PoP) Family

National Semiconductor ...
MTC16 16 Lead Molded Thin Shrink Small Outline Package, JEDEC NS Package Number MTC16

Abracon Corporation
ASDM1-100.000MHZ-LC-T ULTRA MINIATURE PLASTIC PACKAGE ULTRA MINIATURE PLASTIC PACKAGE

Texas Instruments
TDA2P-ABZ ADAS Applications Processor 23mm Package (ABZ Package) Silicon Revision 1.0
TDA2SX ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0
TDA2P-ABZ_19 Applications Processor 23mm Package (ABZ Package) Silicon Revision 1.0

Lite-On Technology Corp...
LTSN-H213EGBW ROHS/ Package in 8mm tape on 7" diameter reels/ EIA STD package

Integrated Circuit Syst...
MK2761A Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)

Texas Instruments
TDA2-17 ADAS Applications Processor 17mm Package (AAS Package) Silicon Revision 2.0

National Semiconductor ...
MC28B 28 Lead Ceramic Small Outline Package, EPROM NS Package

Sharp Electrionic Compo...
PC411L0YIP0F High Speed 15Mb/s, High CMR Mini-flat Package OPIC Mini-flat Package ∗OPIC

Vectron International, ...
C4505 OCXO Surface Mount Package Reflow Process Compatible AT-Cut and SC-Cut Crystal Options Compact Package

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