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PACKAGE Fiches techniques, Datasheet

Lowpower Semiconductor inc(6)NXP Semiconductors(70)P-tec Corporation(550)Pan Jit International Inc.(8)Panasonic Battery Group(7)Panasonic Semiconductor(27)Pasternack Enterprises, Inc.(74)PCA ELECTRONICS INC.(8)Peregrine Semiconductor(2)Peregrine Semiconductor Corp.(1)Pericom Semiconductor Corporation(13)PETERMANN-TECHNIK(14)PhaseLink Corporation(1)PHOENIX CONTACT(3)Pletronics, Inc.(1)Polyfet RF Devices(1)Power-One(8)Premier Magnetics, Inc.(9)Protek Devices(9)Pulse A Technitrol Company(4)Purdy Electronics Corporation(25)QT Optoelectronics(1)Quantum Research Group(1)QUARTZCOM the communications company(9)Raltron Electronics Corporation(6)RCD COMPONENTS INC.(1)Recom International Power(22)Rectron Semiconductor(6)Renesas Technology Corp(15)RF Micro Devices(2)RF Monolithics, Inc(26)RFHIC(9)Rhombus Industries Inc.(20)Richtek Technology Corporation(12)RICOH electronics devices division(3)Rochester Electronics(4)Rohm(60)Roithner LaserTechnik GmbH(20)RSG Electronic Components GmbH(7)Sames(1)Samsung semiconductor(5)Sangdest Microelectronic (Nanjing) Co., Ltd(8)Sanken electric(9)SanRex Corporation(6)Sanyo Semicon Device(9)SCHOTT CORPORATION(5)Seiko Instruments Inc(26)Seme LAB(528)Semtech Corporation(1)SEMTECH ELECTRONICS LTD.(1)Sensitron(3)Sensortechnics GmbH(3)Seoul Semiconductor(41)Shanghai Semitech Semiconductor Co., Ltd(12)Sharp Electrionic Components(101)SHIKE Electronics(10)Shindengen Electric Mfg.Co.Ltd(41)Shoulder Electronics Limited.(2)Shunye Enterprise(1)Siemens Semiconductor Group(41)Silan Microelectronics Joint-stock(4)Silicon Laboratories(2)Silonex Inc.(8)Sirectifier Global Corp.(1)SIRENZA MICRODEVICES(4)Skyworks Solutions Inc.(16)SMSC Corporation(8)Solid State Optronic(53)Solid States Devices, Inc(12)Solitron Devices Inc.(1)SPANSION(19)Stanford Microdevices(1)STANLEY ELECTRIC CO.,LTD.(13)Stanson Technology(8)StarHope(1)STATEK CORPORATION(1)STATS ChipPAC, Ltd.(1)STMicroelectronics(158)SunLED Corporation(295)Surge Components(2)SynQor Worldwide Headquarters(3)TAI-SAW TECHNOLOGY CO., LTD.(2)TAITRON Components Incorporated(8)Taiwan Semiconductor Company, Ltd(3)Tak Cheong Electronics (Holdings) Co.,Ltd(47)TE Connectivity Ltd(5)TelCom Semiconductor, Inc(1)Teledyne Technologies Incorporated(3)TEMEX(4)TEMIC Semiconductors(3)Texas Instruments(124)Texas Instruments(234)THine Electronics, Inc.(5)Thinki Semiconductor Co., Ltd.(20)Torex Semiconductor(7)Toshiba Semiconductor(12)Total Power International(36)Transcom, Inc.(2)TRANSYS Electronics Limited(1)TriQuint Semiconductor(12)TT Electronics.(34)Vishay Telefunken(1)
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Description trouvée : 'PACKAGE' - Totale: 12321 (1/617) Pages
FabricantNo de pièceVoirDescription

Vectron International, ...
C4550 OCXO Surface Mount Package Optional Reflow Process Compatible Optional AT-Cut and SC-Cut Crystal Options Low Profile Compact Package

Shindengen Electric Mfg...
S20WB60_17 Square In-line Package (Input/Output In-line Package)

List of Unclassifed Man...
PFKC05 5 WATTS REGULATED OUTPUT POWER / STANDARD 24 PIN DIP PACKAGE & SMD TYPE PACKAGE

Panasonic Semiconductor
JW1AFSN-DC12V-F Miniature package with universal Miniature package with universal

Texas Instruments
TDA2PSX-ACD ADAS Applications Processor 23mm Package (ACD Package) Silicon Revision 1.0
TDA2P-ACD ADAS Applications Processor 23mm Package (ACD Package) Silicon Revision 1.0

Integrated Circuit Solu...
ICS280 Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body)

National Semiconductor ...
D24K 24 Lead (0.400× Wide) Ceramic Sidebrazed Dual-in-Line Package NS Package Number D24K

Zetex Semiconductors
SOD523 Surface mounted, 2 pin package Package outline

Texas Instruments
TDA2P-ACD_19 ADAS Applications Processor 23mm Package (ACD Package) Silicon Revision 1.0

Tyco Electronics
V23100-V4 Dual In-line Package and Single In-line Package Dry Reed Relays

Texas Instruments
TDA2EG SoC for Advanced Driver Assistance Systems (ADAS) 23mm Package (ABC Package) Silicon Revision 2.0

National Semiconductor ...
D24C 24 Lead Ceramic Sidebrazed Dual-in-Line Package NS Package Number D24C

Texas Instruments
LP3982ILD-ADJ MAX8860 Pin, Package and Spec. Compatible, WSON Space Saving Package

Elantec Semiconductor
MDP0040 PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE

Zetex Semiconductors
SC70-5 Surface mounted, 5 pin package Package outline

Advanced Power Electron...
AP2622GY-HF Low Gate Charge, Small Package Outline, Surface Mount Package

Fairchild Semiconductor
MSA20 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20

National Semiconductor ...
D40C 40 Lead Ceramic Sidebrazed Dual-in-Line Package NS Package Number D40C

Shindengen Electric Mfg...
S10WB60_17 Square In-line Package (Input/Output In-line Package)

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