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PACKAGE Fiches techniques, Datasheet

Agilent(Hewlett-Packard)(34)Fairchild Semiconductor(57)FCI connector(1)Finisar Corporation.(18)First Components International(4)Formosa MS(2)Foshan Blue Rocket Electronics Co.,Ltd.(1724)Fox Electronics(2)Freescale Semiconductor, Inc(1)Fuji Electric(96)Fujikura Ltd.(4)Fujitsu Component Limited.(11)Future Technology Devices International Ltd.(1)FutureWafer Tech Co.,Ltd(11)Gamma Microelectronics Inc.(2)Gaomi Xinghe Electronics Co., Ltd.(1)GeneSiC Semiconductor, Inc.(15)Gilway Technical Lamp(1)Global Mixed-mode Technology Inc(157)Golledge Electronics Ltd(43)Grayhill, Inc(4)Green Power Solutions srl(4)GSI Technology(306)Hamamatsu Corporation(43)HB Electronic Components(2)Hi-Sincerity Mocroelectronics(2)Hitachi Semiconductor(1)HITRON ELECTRONICS CORPORTION(12)Holt Integrated Circuits(1)Holtek Semiconductor Inc(10)Honeywell Accelerometers(15)Honeywell Solid State Electronics Center(6)HuaXinAn Electronics CO.,LTD(2)HY ELECTRONIC CORP.(2)IDEA.lnc.(10)IK Semicon Co., Ltd(2)ILSI America LLC(81)Inchange Semiconductor Company Limited(41)Infineon Technologies AG(37)Integrated Circuit Solution Inc(1)Integrated Circuit Systems(1)Integrated Device Technology(8)Integrated Silicon Solution, Inc(3)Integrated Technology Future(1)Intel Corporation(4)InterFET Corporation(1)International Rectifier(161)Intersil Corporation(4)Intronics Power, Inc.(1)IQD Frequency Products Ltd(11)IRC - a TT electronics Company.(1)Ironwood Electronics.(2)Isahaya Electronics Corporation(2)ITT Industries(1)IXYS Corporation(38)Japan Aviation Electronics Industry, Ltd.(1)JDS Uniphase Corporation(2)JMK Inc.(2)SHANTOU HUASHAN ELECTRONIC DEVICES CO.,LTD(28)
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Description trouvée : 'PACKAGE' - Totale: 12321 (1/617) Pages
FabricantNo de pièceVoirDescription

Advanced Power Electron...
AP2622GY-HF Low Gate Charge, Small Package Outline, Surface Mount Package

Fairchild Semiconductor
MSA20 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20

National Semiconductor ...
D40C 40 Lead Ceramic Sidebrazed Dual-in-Line Package NS Package Number D40C

Shindengen Electric Mfg...
S10WB60_17 Square In-line Package (Input/Output In-line Package)

Vectron International, ...
C4530 OCXO Surface Mount Package Reflow Process Compatible AT-Cut and SC-Cut Crystal Options Low Profile Compact Package

Shindengen Electric Mfg...
S15WB60_17 Square In-line Package (Input/Output In-line Package)

National Semiconductor ...
J24A 24 Lead Ceramic Dual-in-Line Package NS Package Number J24A
D16D 16 Lead Hybrid Metal Can Dual-in-Line Package NS Package Number D16D

Amkor Technology
PSVFBGA Package on Package (PoP) Family

Advanced Power Technolo...
APT5010B2VRG New T-MAX™ Package (Clip-mounted TO-247 Package)

Abracon Corporation

Texas Instruments
TDA2P-ABZ ADAS Applications Processor 23mm Package (ABZ Package) Silicon Revision 1.0
TDA2SX ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0

National Semiconductor ...
MTC16 16 Lead Molded Thin Shrink Small Outline Package, JEDEC NS Package Number MTC16

Lite-On Technology Corp...
LTSN-H213EGBW ROHS/ Package in 8mm tape on 7" diameter reels/ EIA STD package

Integrated Circuit Syst...
MK2761A Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)

Texas Instruments
TDA2-17 ADAS Applications Processor 17mm Package (AAS Package) Silicon Revision 2.0
TDA2P-ABZ_19 Applications Processor 23mm Package (ABZ Package) Silicon Revision 1.0

Sharp Electrionic Compo...
PC411L0YIP0F High Speed 15Mb/s, High CMR Mini-flat Package OPIC Mini-flat Package ∗OPIC

Vectron International, ...
C4505 OCXO Surface Mount Package Reflow Process Compatible AT-Cut and SC-Cut Crystal Options Compact Package

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