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PACKAGE Fiches techniques, Datasheet

HK TO-GRACE TECHNOLOGY CO.,LTD.(212)Lowpower Semiconductor inc(10)NXP Semiconductors(70)P-tec Corporation(550)Pan Jit International Inc.(8)Panasonic Battery Group(7)Panasonic Semiconductor(27)PANDUIT CORP.(1)Pasternack Enterprises, Inc.(74)PCA ELECTRONICS INC.(8)Peregrine Semiconductor(2)Peregrine Semiconductor Corp.(1)Pericom Semiconductor Corporation(13)PETERMANN-TECHNIK(14)PhaseLink Corporation(1)PHOENIX CONTACT(7)Pletronics, Inc.(1)Polyfet RF Devices(1)Power-One(8)Premier Magnetics, Inc.(9)Protek Devices(9)Pulse A Technitrol Company(4)Purdy Electronics Corporation(25)QT Optoelectronics(1)Quantum Research Group(1)QUARTZCOM the communications company(9)Quectel Wireless Solutions Co., Ltd.(1)Raltron Electronics Corporation(6)RCD COMPONENTS INC.(1)Recom International Power(22)Rectron Semiconductor(6)Renesas Technology Corp(15)RF Micro Devices(2)RF Monolithics, Inc(26)RFHIC(9)Rhombus Industries Inc.(20)Richtek Technology Corporation(12)RICOH electronics devices division(3)Rochester Electronics(4)Rohm(61)Roithner LaserTechnik GmbH(20)RSG Electronic Components GmbH(7)Sames(1)Samsung semiconductor(5)Sangdest Microelectronic (Nanjing) Co., Ltd(8)Sanken electric(9)SanRex Corporation(6)Sanyo Semicon Device(9)SCHOTT CORPORATION(5)Seiko Instruments Inc(26)Seme LAB(528)Semtech Corporation(2)SEMTECH ELECTRONICS LTD.(1)Sensitron(3)Sensortechnics GmbH(3)Seoul Semiconductor(41)Shanghai Semitech Semiconductor Co., Ltd(12)Sharp Electrionic Components(101)SHIKE Electronics(10)Shindengen Electric Mfg.Co.Ltd(41)Shoulder Electronics Limited.(2)Shunye Enterprise(1)Siemens Semiconductor Group(41)Silan Microelectronics Joint-stock(4)Silicon Laboratories(2)Silonex Inc.(8)Sirectifier Global Corp.(1)SIRENZA MICRODEVICES(4)Skyworks Solutions Inc.(16)SMSC Corporation(8)Solid State Optronic(53)Solid States Devices, Inc(12)Solitron Devices Inc.(1)SPANSION(19)Stanford Microdevices(1)STANLEY ELECTRIC CO.,LTD.(13)Stanson Technology(8)StarHope(1)STATEK CORPORATION(1)STATS ChipPAC, Ltd.(1)STMicroelectronics(163)SunLED Corporation(295)Surge Components(2)SynQor Worldwide Headquarters(3)TAI-SAW TECHNOLOGY CO., LTD.(2)TAITRON Components Incorporated(8)Taiwan Semiconductor Company, Ltd(3)Tak Cheong Electronics (Holdings) Co.,Ltd(47)TE Connectivity Ltd(5)TelCom Semiconductor, Inc(1)Teledyne Technologies Incorporated(3)TEMEX(4)TEMIC Semiconductors(3)Texas Instruments(281)Texas Instruments(126)THine Electronics, Inc.(5)Thinki Semiconductor Co., Ltd.(27)Torex Semiconductor(7)Toshiba Semiconductor(12)Total Power International(36)Transcom, Inc.(2)TRANSYS Electronics Limited(1)TriQuint Semiconductor(12)TT Electronics.(34)Vishay Telefunken(1)
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Description trouvée : 'PACKAGE' - Totale: 12662 (1/634) Pages
FabricantNo de pièceVoirDescription
Company Logo Img
National Semiconductor ...
D16D Datasheet pdf image 16 Lead Hybrid Metal Can Dual-in-Line Package NS Package Number D16D
Company Logo Img
Zetex Semiconductors
SOD523 Datasheet pdf image Surface mounted, 2 pin package Package outline
Company Logo Img
National Semiconductor ...
MC28B Datasheet pdf image 28 Lead Ceramic Small Outline Package, EPROM NS Package
Company Logo Img
Lite-On Technology Corp...
LTSN-H213EGBW Datasheet pdf image ROHS/ Package in 8mm tape on 7" diameter reels/ EIA STD package
Company Logo Img
Integrated Circuit Syst...
MK2761A Datasheet pdf image Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
Company Logo Img
Vectron International, ...
C4550 Datasheet pdf image OCXO Surface Mount Package Optional Reflow Process Compatible Optional AT-Cut and SC-Cut Crystal Options Low Profile Compact Package
Company Logo Img
Texas Instruments
TDA2SX_V01 Datasheet pdf image TDA2x ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0
Company Logo Img
Fairchild Semiconductor
MSA20 Datasheet pdf image 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20
Company Logo Img
Vectron International, ...
C4505 Datasheet pdf image OCXO Surface Mount Package Reflow Process Compatible AT-Cut and SC-Cut Crystal Options Compact Package
Company Logo Img
Texas Instruments
TDA2E-17 Datasheet pdf image SoC for Advanced Driver Assistance Systems (ADAS) 17mm Package (CBD Package)
LP3982ILD-ADJ Datasheet pdf image MAX8860 Pin, Package and Spec. Compatible, WSON Space Saving Package
Company Logo Img
Sharp Electrionic Compo...
PC411L0YIP0F Datasheet pdf image High Speed 15Mb/s, High CMR Mini-flat Package OPIC Mini-flat Package ∗OPIC
Company Logo Img
National Semiconductor ...
MC16A Datasheet pdf image 16 Lead Ceramic Small Outline Package NS Package Number MC16A
Company Logo Img
Abracon Corporation
ASDM1-100.000MHZ-LC-T Datasheet pdf image ULTRA MINIATURE PLASTIC PACKAGE ULTRA MINIATURE PLASTIC PACKAGE
Company Logo Img
National Semiconductor ...
MTC16 Datasheet pdf image 16 Lead Molded Thin Shrink Small Outline Package, JEDEC NS Package Number MTC16
Company Logo Img
Continental Device Indi...
TO-263 Datasheet pdf image TO-263 D PAK SMD Plastic Package Package Outline and Packaging Information
Company Logo Img
Hamamatsu Corporation
S9648-100 Datasheet pdf image Plastic package shaped the same as metal package
Company Logo Img
Shindengen Electric Mfg...
S20WB60_17 Datasheet pdf image Square In-line Package (Input/Output In-line Package)
Company Logo Img
Texas Instruments
TDA2EG-17 Datasheet pdf image SoC for Advanced Driver Assistance Systems (ADAS) 17mm Package (CBD Package) Silicon Revision 2.0
TDA2-17 Datasheet pdf image ADAS Applications Processor 17mm Package (AAS Package) Silicon Revision 2.0

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