Fabricant | No de pièce | Fiches technique | Description |
International Rectifier
|
IR3575 |
900Kb/23P |
60A Exposed Top Integrated PowIRstage |
IR3575 |
955Kb/22P |
60A Exposed Top Integrated PowIRstage |
IR3579 |
82Kb/1P |
60A Exposed-Top Integrated PowIRstage |
IR3579A |
81Kb/1P |
60A Exposed-Top Integrated PowIRstage |
IR3578 |
82Kb/1P |
50A Exposed-Top Integrated PowIRstage |
Advanced Power Electron...
|
AP2434GN3-HF |
94Kb/4P |
Bottom Exposed DFN |
AP4527GN3 |
101Kb/7P |
Bottom Exposed DFN |
AP2428GN3 |
179Kb/5P |
Bottom Exposed DFN |
AP6970GN2-HF |
107Kb/4P |
Bottom Exposed DFN, Lower Profile |
AP2430GN3-HF |
96Kb/4P |
Bottom Exposed DFN, Low On-resistance |
AP4527GN3 |
101Kb/7P |
Bottom Exposed DFN, Low On-resistance |
AP2434GN3-HF |
94Kb/4P |
Bottom Exposed DFN, Low On-resistance |
STATS ChipPAC, Ltd.
|
QFP-EP |
117Kb/2P |
Exposed Pad Quad Flat Pack |
Maxim Integrated Produc...
|
21-0109B |
35Kb/1P |
PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD Rev B |
Advanced Power Electron...
|
AP2428GN3 |
179Kb/5P |
Bottom Exposed DFN, Low On-resistance |
Maxim Integrated Produc...
|
21-0108 |
71Kb/2P |
PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD Rev K |
21-0111 |
31Kb/1P |
PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD Rev E |
Hirose Electric
|
GT9-12S-2.54DSA |
146Kb/5P |
Developed for Equipment Exposed to Harsh Environmental Conditions |
STATS ChipPAC, Ltd.
|
MQFP-ED |
99Kb/2P |
Exposed Drop-in Heat Slug Metric Quad Flat Pack |
Maxim Integrated Produc...
|
21-0137 |
48Kb/2P |
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3*3*0.80MM Rev J |