Moteur de recherche de fiches techniques de composants électroniques |
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ENCAPSULATION Fiches technique, PDF |
Mot-clé recherché : 'ENCAPSULATION' - Totale: 67 (1/4) Pages |
Fabricant | No de pièce | Fiches technique | Description |
PANDUIT CORP. |
D-300-01 |
131Kb/7P |
CAP, SPLICE ENCAPSULATION |
D-300-08 |
76Kb/7P |
CAP, SPLICE ENCAPSULATION | |
List of Unclassifed Man... |
ATC900C |
182Kb/6P |
Available with Encapsulation Option |
SM2615FTR845 |
131Kb/2P |
High temperature molded encapsulation | |
Hitachi Semiconductor |
DNA1002D |
50Kb/1P |
HITACHI Encapsulation, DIP 16 |
MPS Industries, Inc. |
R7X1210M |
160Kb/1P |
ENCAPSULATION MOLDED CHIP INDUCTOR |
Vishay Siliconix |
WSRHP |
103Kb/4P |
Molded high temperature encapsulation Revision: 21-Oct-16 |
List of Unclassifed Man... |
SM6227FT1R00 |
131Kb/2P |
High temperature molded encapsulation |
MPS Industries, Inc. |
R7X1008M |
160Kb/1P |
ENCAPSULATION MOLDED CHIP INDUCTOR |
List of Unclassifed Man... |
SM6227JT62R0 |
130Kb/2P |
High temperature molded encapsulation |
M.S. Kennedy Corporatio... |
MSK4890 |
604Kb/5P |
Proprietary Encapsulation Provides Near Hermetic Performance |
MSK4891 |
363Kb/5P |
Proprietary Encapsulation Provides Near Hermetic Performance | |
Vishay Siliconix |
WSCWSN |
101Kb/3P |
All welded construction, Molded encapsulation, Wraparound terminations Revision: 17-Feb-11 |
KODENSHI_AUK CORP. |
SP217 |
153Kb/3P |
TO-5 type header with clear epoxy encapsulation |
AVAGO TECHNOLOGIES LIMI... |
ASMT-QWBF-NKL0E |
131Kb/10P |
High reliability package with enhanced silicone resin encapsulation |
ASMT-QYBG |
182Kb/9P |
High reliability package with enhanced silicone resin encapsulation | |
ASMT-UYBG |
181Kb/10P |
High reliability package with enhanced silicone resin encapsulation | |
ASMT-JB11-NMP01 |
72Kb/2P |
Silicone Encapsulation for LED Advantages and Handling Precautions | |
ASMT-UWBG |
181Kb/10P |
High reliability package with enhanced silicone resin encapsulation | |
Sangdest Microelectroni... |
209CNQ |
140Kb/4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and |
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