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DUAL Fiches techniques, Datasheet

DENSEI-LAMBDA(6)Guangdong Kexin Industrial Co.,Ltd(71)KEC(Korea Electronics)(46)Kemet Corporation(19)Kersemi Electronic Co., Ltd.(7)Keysight Technologies(3)Kingbor Technology Co(2)Kingbright Corporation(93)KODENSHI KOREA CORP.(190)Laird Tech Smart Technology(3)LANSDALE Semiconductor Inc.(23)LAPIS Semiconductor Co., Ltd.(1)Lattice Semiconductor(1)Leshan Radio Company(202)Level One(7)LightKey Optoelectronics Ltd.(23)LIGITEK electronics co., ltd.(303)Lineage Power Corporation(1)Linear Dimensions Semiconductor(16)Linear Integrated Systems(63)Linear Technology(979)Linkage Goston Electronics Co., LTD(2)LinkCom Manufacturing Co., Ltd.(1)Lite-On Technology Corporation(25)Littelfuse(16)LOGIC Devices Incorporated(4)Lucky Light Electronic(13)LUMEX INC.(88)Luna Innovations Incorporated(2)Lyontek Inc.(6)M.S. Kennedy Corporation(25)M/A-COM Technology Solutions, Inc.(38)MagnaChip Semiconductor.(14)Magnetrol International, Inc.(1)Major League Electronics(101)Make-Ps(40)Mallory performance club(10)Marktech Corporate(10)Maxim Integrated Products(403)Maxwell Technologies(4)Mean Well Enterprises Co., Ltd.(109)Megawin Technology Co., Ltd(3)Melexis Microelectronic Systems(7)Merrimac Industries, Inc.(2)MIC GROUP RECTIFIERS(4)Micrel Semiconductor(225)Micro Analog systems(2)Micro Commercial Components(67)Micro Electronics(21)Micro Linear Corporation(5)Microchip Technology(122)Microdc power Technology Co., Ltd(20)Micron Technology(1)Micronas(2)Micronetics, Inc.(1)Micropac Industries(6)MicroPower Direct, LLC(79)Microsemi Corporation(275)Micross Components(422)Mimix Broadband(8)Mini-Circuits(16)Minilogic Device Corporation Limited(3)Minmax Technology Co., Ltd.(44)Mitel Networks Corporation(15)Mitsubishi Electric Semiconductor(30)Molex Electronics Ltd.(1077)Molex Electronics Ltd.(626)Molex Electronics Ltd.(2156)Molex Electronics Ltd.(498)Molex Electronics Ltd.(3663)Molex Electronics Ltd.(344)Molex Electronics Ltd.(112)Molex Electronics Ltd.(441)Molex Electronics Ltd.(109)Molex Electronics Ltd.(622)Molex Electronics Ltd.(602)Molex Electronics Ltd.(595)MolexKits(6)Monolithic Power Systems(70)MORE Semiconductor Company Limited(16)MORNSUN Science& Technology Ltd.(38)MOSA ELECTRONICS(13)Mosel Vitelic, Corp(1)Mospec Semiconductor(140)Motorola, Inc(232)MPS Industries, Inc.(21)MRV Communications, Inc.(12)MTRONPTI(1)Murata Manufacturing Co., Ltd.(39)Murata Power Solutions Inc.(18)Nais(Matsushita Electric Works)(1)NanoAmp Solutions, Inc.(1)National Instruments Corporation(6)National Semiconductor (TI)(532)NEC(59)Nell Semiconductor Co., Ltd(10)New Japan Radio(100)New Jersey Semi-Conductor Products, Inc.(45)NIHON DEMPA KOGYO(1)Nihon Inter Electronics Corporation(44)NIKO SEMICONDUCTOR CO., LTD.(10)Nippon Precision Circuits Inc(3)NTE Electronics(157)Numonyx B.V(8)NXP Semiconductors(306)OEN India Limited(2)OKI electronic componets(11)OmniVision Technologies, Inc.(1)Omron Electronics LLC(10)ON Semiconductor(1227)OPLINK Communications Inc.(12)Opnext. Inc.(1)OPTEK Technologies(8)OptoDiode Corp(2)Optoway Technology Inc(87)ORing Industrial Networking Corp(7)ORION FANS(7)Orister Corporation(1)OSRAM GmbH(3)Oxford Semiconductor(4)Shanghai Leiditech Electronic Technology Co., Ltd(2)Shenzhen Luguang Electronic Technology Co., Ltd(21)Tyco Electronics(60)Wuxi NCE Power Semiconductor Co., Ltd(1)
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Description trouvée : 'DUAL' - Totale: 602 (1/31) Page
FabricantNo de pièceVoirDescription

Molex Electronics Ltd.
0877971200 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 12 Circuits, 0.76μm (30μ) Gold (Au) Plating, 8.00mm (.315) Stacking Height
0877615001 2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.75μm (30μ) Gold (Au) Selective Plating, 10.30mm (.406) Stacking Height
0877614408 2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Through Hole, Vertical, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, 12.50mm (.492) Stacking
0877612400 2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Through Hole, Vertical, 24 Circuits, 0.75μm (30μ) Gold (Au) Selective Plating
0879392000 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 20 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 15.35mm(.604) Stacking Height
0877970602 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 6 Circuits, 0.76μm (30μ) Gold (Au) Plating, 25.60mm (1.043) Stacking Height
0877615022 2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, 5.71mm (.225) Stacking Height
0877970040 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 40 Circuits, 2.54μm (100μ) Tin (Sn) Plating, 14.22mm (.560) Stacking Height
0879394001 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 40 Circuits, 0.75μm (30μ) Gold (Au) Selective Plating, 6.40mm(.251)
0877621633 2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Surface Mount, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
0879390001 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
0877970010 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging
0877612001 2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Through Hole, Vertical, 20 Circuits, 0.75μm (30μ) Gold (Au) Selective Plating
0877971800 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 18 Circuits, Gold (Au) Flash Plating, 9.35mm (.368) Stacking Height, Tray Packaging
0877615021 2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, 8.70mm (.343) Stacking Height
0878345095 2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating
0878351442 2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
0879143816 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 38 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0905712601 2.54mm (.100) Pitch QF-50™ Header, Vertical, Dual Row, Shrouded, DIN Keying, 60 Circuits, 0.1 μm Gold (Au)
0901303126 2.54mm (.100) Pitch C-Grid III™ Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 26 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

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