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CHIP Fiches techniques, Datasheet

Lowpower Semiconductor inc(1)Nuvotem Talema(1)NXP Semiconductors(31)P-tec Corporation(1)PACELEADER INDUSTRIAL(4)Pacific Silicon Sensor,Inc.(1)Panasonic Battery Group(11)Panasonic Semiconductor(590)PARA LIGHT ELECTRONICS CO., LTD.(4)PCA ELECTRONICS INC.(4)Peregrine Semiconductor(1)Pericom Semiconductor Corporation(3)PerkinElmer Optoelectronics(2)PhaseLink Corporation(2)PHOENIX CONTACT(6)Pixart Imaging Inc.(21)PLX Technology(3)PMC-Sierra, Inc(1)Pomona Electronics(16)Potato Semiconductor Corporation(4)Powerex Power Semiconductors(1)Precid-Dip Durtal SA(3)PREMO CORPORATION S.L(6)Princeton Technology Corp(2)Productwell Precision Elect.CO.,LTD(3)Protek Devices(76)Pulse A Technitrol Company(18)PulseCore Semiconductor(4)Purdy Electronics Corporation(4)Pyramid Semiconductor Corporation(5)Radiometrix Ltd(2)Raltron Electronics Corporation(29)RCD COMPONENTS INC.(17)Rectron Semiconductor(3)Renesas Technology Corp(18)RF Monolithics, Inc(2)RFE international(5)RHOPOINT COMPONENTS(12)Richtek Technology Corporation(1)Riedon Powertron(76)Rochester Electronics(1)Rohm(309)Roithner LaserTechnik GmbH(103)RUBYCON CORPORATION(55)Sames(9)Samsung semiconductor(66)Samtec, Inc(3)SAMWHA ELECTRIC(1)Sangdest Microelectronic (Nanjing) Co., Ltd(1)Sanken electric(6)Sanyo Semicon Device(96)Schurter Inc.(1)Semicoa Semiconductor(22)Semikron International(3)Semtech Corporation(12)Sensortechnics GmbH(1)Seoul Semiconductor(86)SG Micro Corp(1)Sharp Electrionic Components(41)Shenzhen Putianhe Technology Co., Ltd(1)Shenzhen Taychipst Electronic Co., Ltd(1)Shenzhen Tianyuan Semiconductor Co., Ltd.(9)SHIKE Electronics(2)Siemens Semiconductor Group(15)Silicon Laboratories(1)Silicon Storage Technology, Inc(1)Sipex Corporation(4)Sirectifier Global Corp.(2)SiTime Corp.(1)Sitronix Technology Co., Ltd.(3)Skyworks Solutions Inc.(3)SMSC Corporation(15)Socay Electornics Co., Ltd.(6)Solid States Devices, Inc(2)Sony Corporation(172)SPANSION(3)SpectraLinear Inc(2)StarHope(2)STATS ChipPAC, Ltd.(1)STMicroelectronics(105)Sumida Corporation(50)SunLED Corporation(250)Suntan Capacitors(10)Superworld Electronics(135)SyncMOS Technologies,Inc(1)TAITRON Components Incorporated(32)Taiwan Semiconductor Company, Ltd(1)Taiyo Yuden (U.S.A.), Inc(4996)Taoglas antenna solutions(5)TDK Electronics(11360)TE Connectivity Ltd(2)TEMIC Semiconductors(5)Teridian Semiconductor Corporation(1)Texas Instruments(69)Texas Instruments(40)Thinki Semiconductor Co., Ltd.(2)Tiger Electronic Co.,Ltd(4)Token Electronics Industry Co., Ltd.(25)TOKO, Inc(27)Tontek Design Technology(1)Toshiba Semiconductor(88)TriQuint Semiconductor(4)TT Electronics.(28)
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Description trouvée : 'CHIP' - Totale: 31 (1/2) Page
FabricantNo de pièceVoirDescription

NXP Semiconductors
HT1MOA3S30 HITAGTM1 Chip Module
SA2411 +20 dBm single chip linear amplifier for WLAN
TDA5147K 12 V Voice Coil Motor VCM driver and spindle motor drive combination chip
TDA5149G 12 V Voice Coil Motor VCM driver and spindle motor pre-driver combination chip
SA2400A Single chip transceiver for 2.45 GHz ISM band
VES1820X SINGLE CHIP DVB-C CHANNEL RECEIVER
CARD_74LVC1GX04 One chip crystal oscillator driver
UJA1061 Low speed CAN/LIN system basis chip
PCA9504A Glue chip 4
VES9600 SINGLE CHIP DVB-T CHANNEL RECEIVER
HT2MOA3S20 HITAGTM2 Chip Module
TDA5147CH 12 V Voice Coil Motor VCM driver and spindle motor drive combination chip
UJA1078ATW High-speed CAN/dual LIN core system basis chip
PCK940L Low voltage 1 : 18 clock distribution chip
TDA10085HT Single chip DVB-S/DSS channel receiver
LPC2124 Single Chip 32-bit Microcontroller Erratasheet
SAA7110 One Chip Front-end 1 OCF1
SL1ICS3101 I.CODE1 Label IC 97pF Chip Specification
SL1MOA2S30 Contactless Chip Card Module Specification
UJA1069 LIN fail-safe system basis chip

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